Semiconductors
Export controls drew a line, and your exposure does not stop at it. Technology transferred by contract, capacity built below the controlled layer, and an architecture that treats the chip as one layer of four all sit outside the regime your compliance team was built for. Your licensing history, your packaging relationships, and your customers’ China strategies carry exposure the controls never priced. We map it, and we tell you what to do about it.
What you get
An exposure map across licensing, packaging, and partner relationships. Early warning on control-regime shifts in both capitals. Reads on where the architecture moves next and which layers your competitors are ignoring.
Recent work
The packaging analysis published in China Brief at the Jamestown Foundation, identifying a transfer layer nine years of controls never reached. The Five-Year Plan architecture called in The Diplomat before the official translation existed. An assessment of what statutory planning targets change for the decade’s exposure.
Why clients choose this practice
Our findings come from primary Chinese government sources most advisory teams have never read, which is why our clients hear about the shift first.
China Brief · The Jamestown Foundation
The Chip Packaging IP That Export Controls Cannot Reach
Identified the transfer layer that nine years of controls never reached.